Title :
Contacting InP based micro disk lasers on 200 mm Si wafers
Author :
Mandorlo, F. ; Romeo, P. Rojo ; Letartre, X. ; Regreny, P. ; Viktorovitch, P. ; Mandorlo, F. ; Fedeli, J.M. ; Grosse, P.
Author_Institution :
Ecole Centrale de Lyon, Univ. of Lyon, Ecully
Abstract :
Using die to wafer bonding of InP membranes onto silicon wafers, micro laser sources and their contacts can be fabricated in compliance with the CMOS microelectronics standard processes.
Keywords :
CMOS integrated circuits; III-V semiconductors; elemental semiconductors; indium compounds; integrated optoelectronics; membranes; microassembling; microdisc lasers; silicon; wafer bonding; CMOS microelectronics standard process; InP-Si; die bonding; membranes; micro disk lasers; micro laser sources; silicon wafers; size 200 mm; wafer bonding; Biomembranes; Contacts; High speed optical techniques; III-V semiconductor materials; Indium phosphide; Optical losses; Optical materials; Optical resonators; Optical surface waves; Optical waveguides; CMOS; contacts; electrical pumping; laser; micro-disk; micro-electronics; optical interconnects; silicon photonic;
Conference_Titel :
Indium Phosphide and Related Materials, 2008. IPRM 2008. 20th International Conference on
Conference_Location :
Versailles
Print_ISBN :
978-1-4244-2258-6
Electronic_ISBN :
1092-8669
DOI :
10.1109/ICIPRM.2008.4702985
