DocumentCode
1813802
Title
Contacting InP based micro disk lasers on 200 mm Si wafers
Author
Mandorlo, F. ; Romeo, P. Rojo ; Letartre, X. ; Regreny, P. ; Viktorovitch, P. ; Mandorlo, F. ; Fedeli, J.M. ; Grosse, P.
Author_Institution
Ecole Centrale de Lyon, Univ. of Lyon, Ecully
fYear
2008
fDate
25-29 May 2008
Firstpage
1
Lastpage
4
Abstract
Using die to wafer bonding of InP membranes onto silicon wafers, micro laser sources and their contacts can be fabricated in compliance with the CMOS microelectronics standard processes.
Keywords
CMOS integrated circuits; III-V semiconductors; elemental semiconductors; indium compounds; integrated optoelectronics; membranes; microassembling; microdisc lasers; silicon; wafer bonding; CMOS microelectronics standard process; InP-Si; die bonding; membranes; micro disk lasers; micro laser sources; silicon wafers; size 200 mm; wafer bonding; Biomembranes; Contacts; High speed optical techniques; III-V semiconductor materials; Indium phosphide; Optical losses; Optical materials; Optical resonators; Optical surface waves; Optical waveguides; CMOS; contacts; electrical pumping; laser; micro-disk; micro-electronics; optical interconnects; silicon photonic;
fLanguage
English
Publisher
ieee
Conference_Titel
Indium Phosphide and Related Materials, 2008. IPRM 2008. 20th International Conference on
Conference_Location
Versailles
ISSN
1092-8669
Print_ISBN
978-1-4244-2258-6
Electronic_ISBN
1092-8669
Type
conf
DOI
10.1109/ICIPRM.2008.4702985
Filename
4702985
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