DocumentCode :
181389
Title :
Design of a novel SiC MOSFET structure for EV inverter efficiency improvement
Author :
Jong-Seok Lee ; Dae-Hwan Chun ; Jeong-Hee Park ; Young-Kyun Jung ; Ey Goo Kang ; Man Young Sung
Author_Institution :
R&D Div., Hyundai Motors, Seoul, South Korea
fYear :
2014
fDate :
15-19 June 2014
Firstpage :
281
Lastpage :
284
Abstract :
Inverters for electric vehicle motor drive systems are essential in converting the battery´s direct current into alternating current. Si(Silicon) IGBT that is commonly used in inverter modules have large Vce,sat and turn-off time due to p+ drain and tail current. Therefore, inverter modules consist of Si IGBT with relatively low efficiency. If we can use MOSFETs instead of IGBT in inverter modules, it is possible to achieve high efficiency because of short turn-off time and high operating frequency. Yet also has a problem; Si MOSFETs has large on-resistance compared to Si IGBTs. In this study, SiC(Silicon Carbide) was used to make MOSFETs instead of Si. Futhermore, an accumulation channel concept is adapted to a SiC trench MOSFET, namely Trench ACCUFET. Compared with conventional SiC trench MOSFETs, the novel SiC trench ACCUFET structure has not only lower on-resistance but also high breakdown voltage as shown by the simulation results. We fabricated the Trench ACCUFET for verification, and described improvements that is to be made.
Keywords :
automotive electronics; electric vehicles; invertors; power MOSFET; silicon compounds; wide band gap semiconductors; MOSFET structure; SiC; accumulation channel; electric vehicle motor drive systems; high breakdown voltage; inverter efficiency improvement; AC motors; Inverters; Logic gates; MOSFET; Resistance; Silicon carbide; Simulation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Semiconductor Devices & IC's (ISPSD), 2014 IEEE 26th International Symposium on
Conference_Location :
Waikoloa, HI
ISSN :
1943-653X
Print_ISBN :
978-1-4799-2917-7
Type :
conf
DOI :
10.1109/ISPSD.2014.6856031
Filename :
6856031
Link To Document :
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