DocumentCode :
1813967
Title :
GSNoC — The comprehensive design platform for 3-dimensional Networks-on-Chip based many core embedded systems
Author :
Haoyuan Ying ; Hollstein, Thomas ; Hofmann, Klaus
Author_Institution :
Integrated Electron. Syst. Lab., Tech. Univ. Darmstadt, Darmstadt, Germany
fYear :
2013
fDate :
1-5 July 2013
Firstpage :
217
Lastpage :
223
Abstract :
As the embedded system design focus moving from computation-centric to communication-centric, Networks-on-Chip (NoCs) have been selected as the next generation interconnect components for multi/many core systems due to the scalability and high bandwidth. However, the NoCs design has reached the bottleneck in terms of power consumption, data communication latency and chip area nowadays. 3D chip technologies have been brought into the NoCs design field to reduce the communication cost but increase the performance. A comprehensive design platform - Generic Scalable Networks-on-Chip (GSNoC) will be demonstrated in this paper, which can handle the 3D NoCs design at different design levels (application, architecture and circuit). Application generator, NoCs design framework, comprehensive cycle accurate system simulator and an user-friendly Graphic User Interface (GUI) have been developed in the platform. The entire platform is programmed in C++ and the hardware simulation part is programmed in SystemC.
Keywords :
C++ language; embedded systems; graphical user interfaces; logic design; multiprocessing systems; multiprocessor interconnection networks; network-on-chip; 3-dimensional network-on-chip based many core embedded system design platform; 3D chip technologies; C++; GSNoC; GUI; NoC design framework; SystemC; chip area; comprehensive cycle accurate system simulator; data communication latency; generic scalable network-on-chip; hardware simulation; multicore systems; next generation interconnect components; power consumption; scalability; user-friendly graphic user interface; Computer architecture; Graphical user interfaces; Kernel; Routing; System analysis and design; Three-dimensional displays; Through-silicon vias;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
High Performance Computing and Simulation (HPCS), 2013 International Conference on
Conference_Location :
Helsinki
Print_ISBN :
978-1-4799-0836-3
Type :
conf
DOI :
10.1109/HPCSim.2013.6641417
Filename :
6641417
Link To Document :
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