• DocumentCode
    181422
  • Title

    Zero voltage switching characterization of 12 kV SiC N-IGBTs

  • Author

    Kadavelugu, Arun ; Bhattcharya, Subhashish ; Baliga, B. Jayant ; Sei-Hyung Ryu ; Grider, David ; Palmour, J.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
  • fYear
    2014
  • fDate
    15-19 June 2014
  • Firstpage
    350
  • Lastpage
    353
  • Abstract
    This paper reports experimental zero voltage switching (ZVS) characteristics of the state-of-the-art 12 kV SiC N-IGBTs with 2 μm and 5 μm field-stop buffer layer thicknesses. Extensive results up to 7 kV and 150°C are presented for both IGBTs with and without an external snubber capacitor. The 12 kV SiC IGBTs have been found to have significantly larger magnitude of turn-off current bump in comparison to the results reported for the commercial (≤ 6.5 kV) Si IGBTs, because of deep punch-through design. The turn-off current shape is majorly influenced by slower voltage rise before the punch-through, followed by faster voltage rise after the punch-through voltage. In addition, the difference in current gain resulting from different buffer layer thicknesses has considerable effect on the overall switching behavior and energy loss of the two IGBTs. A detailed explanation of all these phenomena is presented along with the considerations for power converter design while employing the ZVS technique with these ultrahigh voltage IGBTs.
  • Keywords
    buffer layers; insulated gate bipolar transistors; power transistors; silicon compounds; snubbers; switching convertors; wide band gap semiconductors; zero voltage switching; N-IGBT; SiC; ZVS; deep punch-through design; external snubber capacitor; field stop buffer layer; power converter design; size 2 mum; size 5 mum; temperature 150 degC; ultrahigh voltage IGBT; voltage 12 kV; zero voltage switching; Buffer layers; Capacitors; Energy loss; Insulated gate bipolar transistors; Silicon carbide; Snubbers; Zero voltage switching;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Semiconductor Devices & IC's (ISPSD), 2014 IEEE 26th International Symposium on
  • Conference_Location
    Waikoloa, HI
  • ISSN
    1943-653X
  • Print_ISBN
    978-1-4799-2917-7
  • Type

    conf

  • DOI
    10.1109/ISPSD.2014.6856048
  • Filename
    6856048