Title :
Impacts of conduction band offset and border traps on Vth instability of gate recessed normally-off GaN MIS-HEMTs
Author :
Woojin Choi ; Hojin Ryu ; Namcheol Jeon ; Minseong Lee ; Neung-Hee Lee ; Kwang-Seok Seo ; Ho-Young Cha
Author_Institution :
Electr. & Comput. Eng., Seoul Nat. Univ., Seoul, South Korea
Abstract :
An investigation of threshold voltage instability in gate recessed normally-off GaN metal insulator semiconductor high electron mobility transistors (MIS-HEMTs) was performed by analyzing the interface states, border traps, and conduction band offset. To reduce the threshold voltage instability with improved dielectric-GaN interface, plasma enhanced atomic layer deposition (PEALD) technique was successfully employed for very thin SiNx (5nm) as an interfacial layer. Forward biased gate leakage current, capacitance-voltage measurements, and current-transient analysis were performed to find the reason for this improvement. Finally, we proposed an importance of border traps and the conduction band offset which is related to trapping mechanism in transfer characteristics.
Keywords :
III-V semiconductors; MISFET; atomic layer deposition; conduction bands; gallium compounds; high electron mobility transistors; interface states; leakage currents; plasma deposition; transient analysis; wide band gap semiconductors; GaN; PEALD technique; border traps; capacitance-voltage measurements; conduction band offset; current-transient analysis; forward biased gate leakage current; gate recessed normally-off MIS-HEMTs; interface state analysis; interfacial layer; metal insulator semiconductor high electron mobility transistors; plasma enhanced atomic layer deposition; threshold voltage instability; transfer characteristics; trapping mechanism; Electron traps; Gallium nitride; Hysteresis; Logic gates; Silicon compounds; Temperature measurement;
Conference_Titel :
Power Semiconductor Devices & IC's (ISPSD), 2014 IEEE 26th International Symposium on
Conference_Location :
Waikoloa, HI
Print_ISBN :
978-1-4799-2917-7
DOI :
10.1109/ISPSD.2014.6856053