Title :
Simulation of passive microwave penetration features in dry medium
Author :
Meng, Z. ; Chen, S. ; Liu, C. ; Du, X. ; Wang, Z.
Author_Institution :
Dept. of Remote Sensing, Jinlin Univ., Changchun
Abstract :
The simulation of passive microwave penetration features in dry medium is very important to estimate the dry medium thickness, especially to retrieve the lunar regolith thickness, which is one of the Chinese lunar exploration missions. Based on layered dry medium model and radiative transfer equation, the microwave penetration features in dry medium are studied in the paper. The results show that the microwave can penetrate bigger depth in low frequencies than that in high frequencies. There exists a maximum penetration thickness thmax(f) to every frequency, and thmax(f) declines sharply with the increasing of frequency. The brightness temperature increases monotonically with the dry medium thickness if the thickness is smaller than thmax(f). The dielectric constants of the dry medium play an important role in evaluating the microwave penetration features. According to the results, a look-up table between dry medium thickness and brightness temperature is generated, which provides a new and efficient way to extract the thickness of dry medium.
Keywords :
lunar rocks; microwave measurement; planetary remote sensing; table lookup; Chinese lunar exploration missions; dielectric constants; layered dry medium model; look-up table; lunar regolith thickness; passive microwave penetration features; radiative transfer equation; Brightness temperature; Dielectric constant; Equations; Frequency; Microwave theory and techniques; Moon; Numerical simulation; Passive microwave remote sensing; Snow; Table lookup; Dry Medium Thickness; Look-up Table; Passive Microwave Technique; Penetration Features; Radiative Transfer Equation;
Conference_Titel :
Microwave and Millimeter Wave Technology, 2008. ICMMT 2008. International Conference on
Conference_Location :
Nanjing
Print_ISBN :
978-1-4244-1879-4
Electronic_ISBN :
978-1-4244-1880-0
DOI :
10.1109/ICMMT.2008.4540792