DocumentCode :
1815217
Title :
Cycle time distributions of semiconductor workstations using aggregate modeling
Author :
Veeger, Casper ; Etman, Pascal ; Rooda, Jacobus ; Van Herk, Joost
Author_Institution :
Syst. Eng. Group, Eindhoven Univ. of Technol., Eindhoven, Netherlands
fYear :
2009
fDate :
13-16 Dec. 2009
Firstpage :
1610
Lastpage :
1621
Abstract :
Recently an aggregate modeling method has been developed to predict cycle time distributions as a function of throughput for manufacturing workstations with dispatching. The aggregate model is a single-server representation of the workstation with a workload-dependent process time distribution, and a workload-dependent overtaking distribution. The process time and overtaking distribution can be determined from arrival and departure events measured from the workstation at the factory floor. In this paper, we validate the proposed method in the context of semiconductor manufacturing. In particular we consider a lithography workstation. First, we present a simulation case that demonstrates the accuracy of the aggregate model to predict cycle time distributions. Second, we apply the aggregate modeling method to a case from semiconductor industry, and illustrate how the method performs using arrival and departure data obtained from the manufacturing execution system.
Keywords :
aggregate planning; lithography; manufacturing systems; production facilities; semiconductor industry; aggregate modeling; cycle time distributions; lithography workstation; manufacturing execution system; manufacturing workstations; production planning; semiconductor industry; semiconductor manufacturing; semiconductor workstations; Aggregates; Dispatching; Predictive models; Production facilities; Pulp manufacturing; Semiconductor device manufacture; Throughput; Time measurement; Virtual manufacturing; Workstations;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Simulation Conference (WSC), Proceedings of the 2009 Winter
Conference_Location :
Austin, TX
Print_ISBN :
978-1-4244-5770-0
Type :
conf
DOI :
10.1109/WSC.2009.5429268
Filename :
5429268
Link To Document :
بازگشت