• DocumentCode
    1815217
  • Title

    Cycle time distributions of semiconductor workstations using aggregate modeling

  • Author

    Veeger, Casper ; Etman, Pascal ; Rooda, Jacobus ; Van Herk, Joost

  • Author_Institution
    Syst. Eng. Group, Eindhoven Univ. of Technol., Eindhoven, Netherlands
  • fYear
    2009
  • fDate
    13-16 Dec. 2009
  • Firstpage
    1610
  • Lastpage
    1621
  • Abstract
    Recently an aggregate modeling method has been developed to predict cycle time distributions as a function of throughput for manufacturing workstations with dispatching. The aggregate model is a single-server representation of the workstation with a workload-dependent process time distribution, and a workload-dependent overtaking distribution. The process time and overtaking distribution can be determined from arrival and departure events measured from the workstation at the factory floor. In this paper, we validate the proposed method in the context of semiconductor manufacturing. In particular we consider a lithography workstation. First, we present a simulation case that demonstrates the accuracy of the aggregate model to predict cycle time distributions. Second, we apply the aggregate modeling method to a case from semiconductor industry, and illustrate how the method performs using arrival and departure data obtained from the manufacturing execution system.
  • Keywords
    aggregate planning; lithography; manufacturing systems; production facilities; semiconductor industry; aggregate modeling; cycle time distributions; lithography workstation; manufacturing execution system; manufacturing workstations; production planning; semiconductor industry; semiconductor manufacturing; semiconductor workstations; Aggregates; Dispatching; Predictive models; Production facilities; Pulp manufacturing; Semiconductor device manufacture; Throughput; Time measurement; Virtual manufacturing; Workstations;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation Conference (WSC), Proceedings of the 2009 Winter
  • Conference_Location
    Austin, TX
  • Print_ISBN
    978-1-4244-5770-0
  • Type

    conf

  • DOI
    10.1109/WSC.2009.5429268
  • Filename
    5429268