Title :
InterSociety Conference on Thermal Phenomena in the Fabrication and Operation of Electronic Components: I-THERM ´88 (Cat. No.88CH2590-8)
Abstract :
The following topics are dealt with: thermal phenomena in electronic devices and packages; connective thermal control of electronic components; enhancing convective and ebullient cooling of electronic components; cryogenic operation of electronic components; thermal control of electronic components; thermofluid phenomena in peripheral equipment; and thermal phenomena in semiconductor processing and package fabrication. Abstracts of individual papers can be found under the relevant classification codes in this or other issues
Keywords :
cooling; heat transfer; integrated circuit technology; packaging; semiconductor technology; connective thermal control; cooling; cryogenic operation; electronic devices; heat transfer; integrated circuits; microelectronics; packages; peripheral equipment; semiconductor processing; thermal phenomena; thermofluid phenomena;
Conference_Titel :
Thermal Phenomena in the Fabrication and Operation of Electronic Components: I-THERM '88, InterSociety Conference on
Conference_Location :
Los Angeles, CA, USA
DOI :
10.1109/ITHERM.1988.28667
