A microcomputer thermal analysis of a Gunn diode in microstrip circuits

Author

Tseng, Ampere A.

Author_Institution

Drexel Univ., Philadelphia, PA, USA

fYear

1988

fDate

11-13 May 1988

Firstpage

21

Lastpage

28

Abstract

A microcomputer finite-element code has been used to analyze the steady-state thermal behavior of a microstrip Gunn diode circuit with the goal of reducing the device temperature by varying microstrip thicknesses. Although the microstrip is designed mainly for electronic purposes, the analysis has shown that it can also provide a favorable thermal environment to alleviate the device temperature. A two-step modeling approach that can reduce the computer memory needed for computation was used to allow the present study to be conducted on a microcomputer. In this approach, the temperature increases in the device and in the heat sink are considered separately. The device temperature is analyzed by the microcomputer finite-element technique. The heat-sink resistance is calculated by simplified analytical schemes

Keywords

Gunn diodes; electronic engineering computing; finite element analysis; heat sinks; microcomputer applications; semiconductor device models; solid-state microwave circuits; strip line components; thermal analysis; Gunn diode; device temperature; finite-element code; heat-sink resistance; microcomputer thermal analysis; microstrip circuits; solid state microwave devices; steady-state thermal behavior; two-step modeling approach; Circuits; Diodes; Finite element methods; Gunn devices; Heat sinks; Microcomputers; Microstrip; Resistance heating; Steady-state; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal Phenomena in the Fabrication and Operation of Electronic Components: I-THERM '88, InterSociety Conference on

Conference_Location

Los Angeles, CA

Type

conf

DOI

10.1109/ITHERM.1988.28671

Filename

28671