An experimental study of thermal resistance of a power semiconductor package

Author

Yuqin, Gu ; Yajue, Wu

Author_Institution

Dept. of Eng. Mech., Tsinghua Univ., Beijing, China

fYear

1988

fDate

11-13 May 1988

Firstpage

37

Lastpage

40

Abstract

An experimental method for measuring packaging material characteristic parameters and the package thermal resistance including the contact resistance is discussed. The physical model based on one-dimensional analysis and the quasi-steady conduction process are developed. A continuous laser beam with uniform intensity is used as a heat source. The thermal diffusivity of beryllia ceramics and the package thermal resistance have been measured. The results can be applied to check the package manufacturing quality

Keywords

contact resistance; packaging; semiconductor devices; semiconductor technology; thermal resistance; BeO ceramics; contact resistance; continuous laser beam; heat source; manufacturing quality; one-dimensional analysis; packaging material characteristic parameters; physical model; power semiconductor package; quasi-steady conduction process; thermal diffusivity; thermal resistance; uniform intensity; Ceramics; Conducting materials; Contact resistance; Electrical resistance measurement; Laser beams; Laser modes; Laser theory; Optical materials; Packaging; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal Phenomena in the Fabrication and Operation of Electronic Components: I-THERM '88, InterSociety Conference on

Conference_Location

Los Angeles, CA

Type

conf

DOI

10.1109/ITHERM.1988.28675

Filename

28675