Title :
An experimental study of thermal resistance of a power semiconductor package
Author :
Yuqin, Gu ; Yajue, Wu
Author_Institution :
Dept. of Eng. Mech., Tsinghua Univ., Beijing, China
Abstract :
An experimental method for measuring packaging material characteristic parameters and the package thermal resistance including the contact resistance is discussed. The physical model based on one-dimensional analysis and the quasi-steady conduction process are developed. A continuous laser beam with uniform intensity is used as a heat source. The thermal diffusivity of beryllia ceramics and the package thermal resistance have been measured. The results can be applied to check the package manufacturing quality
Keywords :
contact resistance; packaging; semiconductor devices; semiconductor technology; thermal resistance; BeO ceramics; contact resistance; continuous laser beam; heat source; manufacturing quality; one-dimensional analysis; packaging material characteristic parameters; physical model; power semiconductor package; quasi-steady conduction process; thermal diffusivity; thermal resistance; uniform intensity; Ceramics; Conducting materials; Contact resistance; Electrical resistance measurement; Laser beams; Laser modes; Laser theory; Optical materials; Packaging; Thermal resistance;
Conference_Titel :
Thermal Phenomena in the Fabrication and Operation of Electronic Components: I-THERM '88, InterSociety Conference on
Conference_Location :
Los Angeles, CA
DOI :
10.1109/ITHERM.1988.28675
