Title :
Mathematical model of a plated-through-hole structure under a load induced by thermal mismatch
Author_Institution :
Digital Equipment Corp., Andover, MA, USA
Abstract :
A mathematical model simulating a plated-through-hole (PTH) structure under a thermal load is proposed to predict its reliability. The PTH structure is treated as a system of hollow disks joined to a barrel. Under the load, the disks respond with bending and the barrel undergoes tension or compression. Simple formulas for estimation of some parameters correlating with failures are presented
Keywords :
circuit reliability; failure analysis; printed circuits; thermal stress cracking; PCB; PTH structure; failures; mathematical model; plated-through-hole structure; printed circuits; reliability; thermal load; thermal mismatch; Bonding; Capacitive sensors; Electric shock; Failure analysis; Mathematical model; Resins; Temperature; Tensile stress; Thermal loading; Thermal stresses;
Conference_Titel :
Thermal Phenomena in the Fabrication and Operation of Electronic Components: I-THERM '88, InterSociety Conference on
Conference_Location :
Los Angeles, CA
DOI :
10.1109/ITHERM.1988.28680
