Title :
Thermal analysis of a two-dimensional electronic board
Author :
Yao, S.C. ; Su, K.E.
Author_Institution :
Dept. of Mech. Eng., Carnegie-Mellon Univ., Pittsburgh, PA, USA
Abstract :
A computer program has been established to evaluate the thermal performance of two-dimensional electronic boards with elements of unequal heights. Details of convective, conductive, and radiative heat transfer are considered. Experiments have been performed in a wind tunnel on a board of 70 elements arranged in 7 columns. Thermal infrared pictures at various flow conditions are taken. The computed results agree well with the experimental data. Some critical but unresolved questions regarding the heat transfer on the pins and at the back side of the board are also discussed
Keywords :
electronic engineering computing; modelling; printed circuits; thermal analysis; computer program; conductive heat transfer; convective heat transfer; flow conditions; radiative heat transfer; thermal IR pictures; thermal performance; two-dimensional electronic board; wind tunnel; Computer network management; Heat transfer; Industrial electronics; Mechanical engineering; Packaging; Pins; Surface resistance; Temperature; Thermal management of electronics; Thermal resistance;
Conference_Titel :
Thermal Phenomena in the Fabrication and Operation of Electronic Components: I-THERM '88, InterSociety Conference on
Conference_Location :
Los Angeles, CA
DOI :
10.1109/ITHERM.1988.28681
