• DocumentCode
    1816054
  • Title

    Forced convection heat transfer of a vertical shrouded fin array

  • Author

    Chyu, M.K. ; Wu, L.X. ; Murthy, J.Y.

  • Author_Institution
    Dept. of Mech. Eng., Carnegie-Mellon Univ., Pittsburgh, PA, USA
  • fYear
    1988
  • fDate
    11-13 May 1988
  • Firstpage
    86
  • Abstract
    Summary form only given. The detailed local distribution is obtained of the convective heat transfer coefficient on the fin structure. A mass transfer system using the naphthalene sublimation technique is chosen for the study. The test model is fabricated by coating a layer of naphthalene on the fin surface; this gives the surface an equivalence to the isothermal boundary condition in heat transfer. This also implies that the fin array has 100% of fin efficiency. A state-of-the-art, computer-automated measurement system is used to acquire the naphthalene surface profiles before and after the surface exposure to the air stream in a wind tunnel. The present test uses fixed values of fin height-to-space ratio (approximately 1.5) and the streamwise dimension (approximately 5 fin heights)
  • Keywords
    convection; cooling; heat sinks; packaging; air stream; convective heat transfer coefficient; fin structure; forced convection; heat sinks; isothermal boundary condition; local distribution; mass transfer system; naphthalene sublimation technique; naphthalene surface profiles; packaging; vertical shrouded fin array; wind tunnel; Coolants; Electronic packaging thermal management; Electronics cooling; Heat sinks; Heat transfer; Microelectronics; Plastic packaging; Surface resistance; Testing; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal Phenomena in the Fabrication and Operation of Electronic Components: I-THERM '88, InterSociety Conference on
  • Conference_Location
    Los Angeles, CA
  • Type

    conf

  • DOI
    10.1109/ITHERM.1988.28683
  • Filename
    28683