High speed PCB & spiral with patch EBG planar integration for EMI reduction

The need of high-speed printed circuit board design has increased in modern integrated circuitry while maintaining signal integrity and EMC standards as they became challenging issue. In this work, a high-speed PCB design which emitted high radiated emissions exceeding the EMC standard limits up to 4.54 GHz, has been fabricated and gone under radiated emission test. The EMI of the proposed PCB at 4.54 GHz has been suppressed using EBG spiral with patch planar that was integrated into the noisy PCB. Analyses of these characteristics indicate that the proposed EBG structures design is appropriate for the target EMI reduction.