Title :
Convective boiling of nitrogen on a short vertical surface
Author :
Crowley, T.J. ; Tuzla, A. ; Wenzel, L.A. ; Chen, J. C C
Author_Institution :
Inst. of Thermo-Fluid Eng. & Sci., Lehigh Univ., Bethlehem, PA, USA
Abstract :
Convective nucleate boiling heat transfer from a plane vertical surface to nitrogen in two-phase flow is discussed. A 6.3-mm diameter heat source was used to represent a single semiconductor chip or chip carrier. Experiments were performed to study the parametric effects of vapor quality and flow rate on the heat transfer coefficient
Keywords :
boiling; cooling; monolithic integrated circuits; N2; chip carrier; convective nucleate boiling; flow rate; heat transfer coefficient; parametric effects; semiconductor chip; short vertical surface; two-phase flow; vapor quality; Copper; Current measurement; Fluid flow measurement; Heat sinks; Heat transfer; Nitrogen; Temperature; Testing; Thermal conductivity; Voltmeters;
Conference_Titel :
Thermal Phenomena in the Fabrication and Operation of Electronic Components: I-THERM '88, InterSociety Conference on
Conference_Location :
Los Angeles, CA
DOI :
10.1109/ITHERM.1988.28691
