DocumentCode
1816247
Title
Unsteady heat transfer near a bluff body in contact with a moving wall
Author
Arnal, M.P. ; Goering, D.J. ; Humphrey, J.A.C.
Author_Institution
Dept. of Mech. Eng., California Univ., Berkeley, CA, USA
fYear
1988
fDate
11-13 May 1988
Firstpage
148
Lastpage
153
Abstract
Results of a numerical study concerning two-dimensional time-dependent laminar flow near a square bluff body are reported. The configuration investigated is that of flow around a square block in contact with a moving wall, with fluid approaching the block parallel to the wall and at the wall speed. This geometry provides a two-dimensional model for the flow near a magnetic head-arm assembly flying over a rotating disk. Numerical calculations were also made for the case of flow past a square block adjacent to a fixed wall. The Reynolds numbers investigated ranged from 100 to 1000. Comparisons between the two calculated cases show that a moving wall exerts a significant destabilizing effect on the recirculation region behind a block, leading to a lower Reynolds number for the onset of flow unsteadiness. The vortex shedding phenomenon has been characterized in terms of the Strouhal number, and plots of Strouhal number versus Reynolds number are presented for the moving wall and fixed wall cases. Plots of the Nusselt number variation with time and Reynolds number are also presented
Keywords
boundary layers; flow instability; heat transfer; laminar flow; magnetic disc storage; vortices; Nusselt number variation; Reynolds numbers; Strouhal number; bluff body; destabilizing effect; flow unsteadiness; magnetic head-arm assembly; moving wall; recirculation region; rotating disk; square block; two-dimensional model; two-dimensional time-dependent laminar flow; vortex shedding phenomenon; Assembly; Disk drives; Electronic components; Engine cylinders; Geometry; Heat transfer; Mechanical engineering; Solid modeling; Stress control; Thermal stresses;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal Phenomena in the Fabrication and Operation of Electronic Components: I-THERM '88, InterSociety Conference on
Conference_Location
Los Angeles, CA
Type
conf
DOI
10.1109/ITHERM.1988.28696
Filename
28696
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