DocumentCode
1816357
Title
Thermal phenomena during the encapsulation of electronic devices
Author
Emerson, John A.
Author_Institution
AT&T Eng. Res. Center, Princeton, NJ, USA
fYear
1988
fDate
11-13 May 1988
Firstpage
190
Lastpage
192
Abstract
Difficulties resulting from plastic encapsulation for large semiconductor chips, electronic modules such as ceramic hybrid circuits, and passive components are classified into three problem areas. These are temperature excursion, moisture, and electrical. The failure related to each item is listed. A review of thermally reduced failures of encapsulated devices, and assembly sequences and testing are discussed for a broad range of applications
Keywords
encapsulation; failure analysis; modules; assembly sequences; electronic devices; encapsulation; failure; hybrid circuits; modules; moisture; passive components; plastic encapsulation; semiconductor chips; temperature excursion; testing; thermally reduced failures; Assembly; Corrosion; Electronic packaging thermal management; Encapsulation; Fabrication; Moisture; Polymers; Protection; Thermal stresses; Thermomechanical processes;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal Phenomena in the Fabrication and Operation of Electronic Components: I-THERM '88, InterSociety Conference on
Conference_Location
Los Angeles, CA
Type
conf
DOI
10.1109/ITHERM.1988.28701
Filename
28701
Link To Document