Title :
Thermal phenomena during the encapsulation of electronic devices
Author :
Emerson, John A.
Author_Institution :
AT&T Eng. Res. Center, Princeton, NJ, USA
Abstract :
Difficulties resulting from plastic encapsulation for large semiconductor chips, electronic modules such as ceramic hybrid circuits, and passive components are classified into three problem areas. These are temperature excursion, moisture, and electrical. The failure related to each item is listed. A review of thermally reduced failures of encapsulated devices, and assembly sequences and testing are discussed for a broad range of applications
Keywords :
encapsulation; failure analysis; modules; assembly sequences; electronic devices; encapsulation; failure; hybrid circuits; modules; moisture; passive components; plastic encapsulation; semiconductor chips; temperature excursion; testing; thermally reduced failures; Assembly; Corrosion; Electronic packaging thermal management; Encapsulation; Fabrication; Moisture; Polymers; Protection; Thermal stresses; Thermomechanical processes;
Conference_Titel :
Thermal Phenomena in the Fabrication and Operation of Electronic Components: I-THERM '88, InterSociety Conference on
Conference_Location :
Los Angeles, CA
DOI :
10.1109/ITHERM.1988.28701
