DocumentCode :
1816473
Title :
III–V metal-oxide-semiconductor technology
Author :
Passlack, Matthias
fYear :
2008
fDate :
25-29 May 2008
Firstpage :
1
Lastpage :
1
Abstract :
This short course on emerging III-V metal-oxide-semiconductor technology covers the following subjects. 1) Application spaces: RF power and CMOS. 2) The silicon CMOS perspective: performance gap beyond the 45 nm node, heterogeneous integration and III-V MOSFET challenges, III-V FET appeal. 3) Oxide/III-V semiconductor interface and surface chemistry. 4) Device concepts for high mobility channels: flatband-mode vs. inversion mode. 5) Electron mobilities in III-V MOSFET channels. 6) GaAs MOSFETs for RF power applications. 7) Proof of concept: InGaAs channel MOSFETs for CMOS applications. 8) Development strategy for non-silicon CMOS: materials proof of concept and volume manufacturing, devices proof of concept. 9) Alternative approaches: graphene channels, impact ionization MOS (i-MOS), interband tunneling MOSFET etc.
Keywords :
CMOS integrated circuits; III-V semiconductors; MOSFET; electron mobility; power semiconductor devices; semiconductor device manufacture; semiconductor-insulator boundaries; surface chemistry; CMOS; GaAs MOSFETs; III-V FET; III-V MOSFET challenges; III-V metal-oxide-semiconductor technology; InGaAs channel MOSFET; RF power application; devices proof of concept; electron mobilities; graphene channels; heterogeneous integration; high mobility channels; impact ionization MOS; interband tunneling MOSFET; materials proof of concept; oxide/III-V semiconductor interface; performance gap; surface chemistry; volume manufacturing; CMOS technology; Chemical technology; Chemistry; FETs; III-V semiconductor materials; MOSFET circuits; Power MOSFET; Radio frequency; Silicon; Space technology;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Indium Phosphide and Related Materials, 2008. IPRM 2008. 20th International Conference on
Conference_Location :
Versailles
ISSN :
1092-8669
Print_ISBN :
978-1-4244-2258-6
Electronic_ISBN :
1092-8669
Type :
conf
DOI :
10.1109/ICIPRM.2008.4703075
Filename :
4703075
Link To Document :
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