Title :
HDTV data carrier separation using a multiplexing filter
Author :
Caldwell, Maurice ; Parikh, Sandip ; Angle, Rod ; Kindsfater, K.
Author_Institution :
David Sarnoff Res. Center, Princeton, NJ, USA
Abstract :
An interleaving, symbol-shaping quadrature demodulator architecture that demodulates the two data carriers in the digital video signal used in the advanced digital high definition television (AD-HDTV) system is described. The demodulator accepts separate 10-b digitized intermediate frequency (IF) data input, for both carriers, to produce spectrally shaped inphase and quadrature baseband signals using only one decimate-by-two 58-tap multiplexed finite-impulse-response (FIR) filter. A 15.36-MHz multiplexed FIR filter has been designed from a high-level description of the filter characteristics using a technology-independent, silicon generator approach. The 58-tap FIR filter achieves the 17% excess bandwidth and the 40-dB attenuation required by the AD-HDTV system. It also achieves an intersymbol interference of 29 dB. The interleaving, all-digital spread-spectrum quadrature amplitude modulation (SS-QAM) demodulator chip is fabricated in a 1.0-μm CMOS N-well process, contains 48 K transistors, and has a die area of 34 mm2 and an estimated 359-mW power dissipation with a 5-V power supply. This architecture makes possible a single-chip, low-cost demodulator
Keywords :
FIR filters; 1 micron; 15.36 MHz; 359 mW; 5 V; CMOS N-well process; FIR filter; HDTV data carrier separation; QAM filter chip; advanced digital high definition television; all-digital; digital video signal; interleaving; intersymbol interference; low-cost demodulator; multiplexing filter; power dissipation; quadrature demodulator architecture; silicon generator approach; single-chip; spread-spectrum; symbol-shaping; Baseband; CMOS technology; Demodulation; Finite impulse response filter; Frequency; HDTV; High definition video; Interleaved codes; Silicon; TV;
Conference_Titel :
Custom Integrated Circuits Conference, 1993., Proceedings of the IEEE 1993
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-0826-3
DOI :
10.1109/CICC.1993.590721