Title :
Thermal test and monitoring [microelectronic structures]
Author :
Székely, Vladimír ; Rencz, Márta
Author_Institution :
Dept. of Electron Devices, Tech. Univ. Budapest, Hungary
Abstract :
We present possible solutions for the life-time thermal monitoring of microelectronic structures. In order to grab the thermal state of an encapsulated device, insertion of one or more temperature sensors is proposed. A new concept temperature sensor element is introduced: the thermal-feedback oscillator (TFO). The TFO has a digital output signal and therefore is suitable for being integrated with other built-in test circuits, such as boundary-scan. Results of the experimental realization of the TFO temperature sensor are presented
Keywords :
digital readout; electric sensing devices; feedback oscillators; integrated circuit packaging; integrated circuit testing; monitoring; temperature measurement; temperature sensors; built-in test circuits; digital output signal; encapsulated device; life-time thermal monitoring; microelectronic structures; sensor element; temperature sensors; thermal-feedback oscillator; CMOS technology; Circuits; Microelectronics; Monitoring; Semiconductor device measurement; Temperature measurement; Temperature sensors; Testing; Thermal sensors; Voltage;
Conference_Titel :
European Design and Test Conference, 1995. ED&TC 1995, Proceedings.
Conference_Location :
Paris
Print_ISBN :
0-8186-7039-8
DOI :
10.1109/EDTC.1995.470328
