• DocumentCode
    1816944
  • Title

    Rapid simulation of substrate coupling effects in mixed-mode ICs

  • Author

    Verghese, Nishath K. ; Allstot, David J. ; Masui, Shoichi

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
  • fYear
    1993
  • fDate
    9-12 May 1993
  • Abstract
    Asymptotic waveform evaluation (AWE) techniques have been used to develop macromodels that allow accurate and efficient simulation of substrate-related parasitic electrical coupling effects using a modified version of SPICE3. While achieving comparable accuracy to a mixed device-circuit simulator (PISCES IIB), simulation time is reduced by several orders of magnitude. The macromodeling technique can be extended to simulate noise coupling in a VLSI chip, in contrast to conventional device-circuit simulators
  • Keywords
    mixed analogue-digital integrated circuits; CAD tool; SPICE3; VLSI chip; asymptotic waveform evaluation; macromodels; mixed-mode IC; modified version; noise coupling; parasitic electrical coupling effects; rapid simulation; simulation time; substrate coupling effects; CMOS technology; Circuit noise; Circuit simulation; Computational modeling; Coupling circuits; Crosstalk; Maxwell equations; Semiconductor device noise; Substrates; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Custom Integrated Circuits Conference, 1993., Proceedings of the IEEE 1993
  • Conference_Location
    San Diego, CA
  • Print_ISBN
    0-7803-0826-3
  • Type

    conf

  • DOI
    10.1109/CICC.1993.590746
  • Filename
    590746