• DocumentCode
    1817004
  • Title

    Electron transport in nanoparticle assemblies

  • Author

    Müller, K. -H ; Herrmann, J. ; Wei, G. ; Raguse, B. ; Wieczorek, L.

  • Author_Institution
    Mater. Sci. & Eng., Future Manuf. Flagship, CSIRO, Lindfield, NSW, Australia
  • fYear
    2010
  • fDate
    22-26 Feb. 2010
  • Firstpage
    316
  • Lastpage
    318
  • Abstract
    The electrical resistance of nanoparticle assemblies in the form of thin films shows semiconductor-like behavior at low temperatures and metal-like behaviour at high temperatures. We show that this resistance behavior is due to the interplay between Coulomb blockade reduced tunneling of electrons between nanoparticles and the thermal expansion of the nanoparticle assembly. We develop a detailed theoretical model that describes the electron transport process and show that the model agrees well with experimental data.
  • Keywords
    Coulomb blockade; electrical resistivity; gold; metallic thin films; nanoparticles; thermal expansion; tunnelling; Au; Coulomb blockade reduced tunneling; electrical resistance; electron transport; metal-like behaviour; nanoparticle assemblies; semiconductor-like behavior; thermal expansion; thin films; Films; Metals; Nanoparticles; Resistance; Temperature measurement; Thermal expansion; Tunneling; Coulomb blockade; nanoparticles; tunneling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nanoscience and Nanotechnology (ICONN), 2010 International Conference on
  • Conference_Location
    Sydney, NSW
  • Print_ISBN
    978-1-4244-5261-3
  • Electronic_ISBN
    978-1-4244-5262-0
  • Type

    conf

  • DOI
    10.1109/ICONN.2010.6045236
  • Filename
    6045236