Integrated power electronics modules for 400 V/10 A motor-drive applications using flip-chip flex-circuit technology

Author

Xiao, Y. ; Shah, H. ; Parrilla, Z. ; Chow, T.P. ; Jahns, T.M. ; Gutmann, R.J.

Author_Institution

Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA

Volume

1

fYear

2003

fDate

15-19 June 2003

Firstpage

431

Abstract

This paper presents the development of an integrated power packaging platform featuring power dies and driver components integration using flex-circuit interconnection and flip-chip soldering technology. The packaging platform that was previously demonstrated suitably for 42 V/16 A automotive applications is extended to 400 V/10 A motor-drive application, with the electrical performance measured at double-pulse and 10% duty-ratio conditions. The switching characteristics of three different IGBT modules implemented with flip-chip dies or discrete commercial packages on flex-circuitry are evaluated.

Keywords

automotive electronics; bridge circuits; flip-chip devices; insulated gate bipolar transistors; modules; motor drives; power electronics; semiconductor device packaging; 10 A; 16 A; 400 V; 42 V; IGBT modules; automotive applications; discrete commercial packages; double-pulse conditions; driver components integration; duty-ratio conditions; electrical performance measurement; flex-circuit interconnection; flex-circuitry; flip-chip dies; flip-chip flex-circuit technology; flip-chip soldering; half-bridge flex-circuit test vehicle assembly; integrated power electronics modules; integrated power packaging platform; motor-drive; packaging platform; power dies; switching characteristics; Application software; Assembly; Circuit testing; Driver circuits; Electronics packaging; Flexible printed circuits; Integrated circuit interconnections; Power electronics; Thermal conductivity; Vehicles;

fLanguage

English

Publisher

ieee

Conference_Titel

Power Electronics Specialist Conference, 2003. PESC '03. 2003 IEEE 34th Annual

ISSN

0275-9306

Print_ISBN

0-7803-7754-0

Type

conf

DOI

10.1109/PESC.2003.1218330

Filename

1218330