A hybrid full-wave analysis of via hole grounds using finite difference and finite element time domain methods

Author

Dongsoo Koh ; Hong-Bae Lee ; Itoh, T.

Author_Institution

Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA

Volume

1

fYear

1997

fDate

8-13 June 1997

Firstpage

89

Abstract

A hybrid full-wave analysis using FDTD (finite difference time domain) and FETD (finite element time domain) methods has been developed to analyze microwave devices with locally arbitrarily shaped three-dimensional structures. This method is applied to calculate the scattering parameters of cylindrical via hole grounds. The comparison of the results with the mode matching data and FDTD staircasing data verifies the accuracy of this analysis.

Keywords

S-parameters; finite difference time-domain analysis; finite element analysis; microstrip lines; waveguide theory; FDTD; FETD; arbitrarily shaped 3D structures; finite difference time domain method; finite element time domain method; hybrid full-wave analysis; microwave devices; scattering parameters; via hole grounded microstrips; Ear; Finite difference methods; Finite element methods; Mesh generation; Microwave devices; Microwave theory and techniques; Scattering parameters; Testing; Time domain analysis; Vectors;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 1997., IEEE MTT-S International

Conference_Location

Denver, CO, USA

ISSN

0149-645X

Print_ISBN

0-7803-3814-6

Type

conf

DOI

10.1109/MWSYM.1997.604528

Filename

604528