• DocumentCode
    1818225
  • Title

    An integrated electro-thermal model of IGBT devices (experimental validation)

  • Author

    Bonsbaine, Amar ; Trigkidis, G. ; Benamrouche, N.

  • Author_Institution
    Univ. of Derby, Derby, UK
  • fYear
    2009
  • fDate
    1-4 Sept. 2009
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    Electro-thermal and thermo-mechanical effects are becoming more and more important in power electronic systems as industry seeks to decrease packaging and increase power densities. Therefore the demand for faster and more accurate thermal models is increasing. The improved multi-dimensional electro-thermal IGBT model based on a lumped parameter modelling method using MATLAB software has been documented in the previous paper. This paper, however, will address the experimental set up, testing and analysis of the results to validate the developed model. In addition the performance of the complete electro-thermal model will be critically analysed in terms of transient and steady-state responses with emphasis on the sensitivity of the model to internal and external inputs.
  • Keywords
    electromechanical effects; electronic engineering computing; insulated gate bipolar transistors; semiconductor device models; thermal analysis; IGBT devices; MATLAB software; complete electrothermal model; electrothermal effects; integrated electrothermal model; lumped parameter modelling; multidimensional electrothermal IGBT model; packaging; power densities; power electronic systems; steady-state response; thermal models; thermomechanical effects; Electronic packaging thermal management; Electronics industry; Insulated gate bipolar transistors; MATLAB; Mathematical model; Performance analysis; Power electronics; Power system modeling; Testing; Thermomechanical processes; IGBT; Loss Density; Thermal Modelling; Transient analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Universities Power Engineering Conference (UPEC), 2009 Proceedings of the 44th International
  • Conference_Location
    Glasgow
  • Print_ISBN
    978-1-4244-6823-2
  • Type

    conf

  • Filename
    5429386