Title :
Size quantization and thermoelectric properties of bismuth telluride nanowires
Author :
Bejenari, I.M. ; Kantser, V.G.
Author_Institution :
Inst. of Electron. Eng. & Ind. Technol., Acad. of Sci. of Moldova, Kishinev
Abstract :
Electronic structure of bismuth telluride quantum wires with growth directions [110] and [015] is studied in the framework of anisotropic effective mass method using parabolic band approximation. The components of the electron and hole effective mass tensor for six valleys are calculated for both growth directions. In the temperature range from 77 K to 500 K, the dependence of the quantum wire Seebeck coefficient, S, electron thermal, kappa, and electrical, sigma, conductivity as well as figure of merit, ZT, on the square quantum wire thickness and excess hole concentration, pex, are investigated in constant relaxation time approximation. For p-type Bi2Te3 quantum wires, the maximum value of the figure of merit is equal to 1.4; 1.6; and 2.8 at the corresponding temperatures 310 K; 390 K; 480 K and quantum wire thickness 30 nm; 15 nm, and 7 nm (pex=5times1018 cm-3).
Keywords :
Seebeck effect; bismuth compounds; effective mass; electronic structure; hole density; nanowires; semiconductor materials; semiconductor quantum wires; thermal conductivity; Bi2Te3; Seebeck coefficient; anisotropic effective mass method; bismuth telluride nanowires; electrical conductivity; electron thermal conductivity; electronic structure; figure of merit; hole concentration; parabolic band approximation; relaxation time approximation; size 15 nm; size 30 nm; size 7 nm; size quantization; temperature 77 K to 500 K; thermoelectric properties; Anisotropic magnetoresistance; Bismuth; Charge carrier processes; Effective mass; Nanowires; Quantization; Tensile stress; Thermal conductivity; Thermoelectricity; Wire; Seebeck coefficient; bismuth telluride; figure of merit; nanowire; size quantization;
Conference_Titel :
Semiconductor Conference, 2008. CAS 2008. International
Conference_Location :
Sinaia
Print_ISBN :
978-1-4244-2004-9
DOI :
10.1109/SMICND.2008.4703389