Interconnect and packaging for applications on the cutting edge

Interconnections and packaging structures are a dominant design consideration of many dimensionally- and performance-constrained systems. The growth in interconnect and its effect on system and packaging evolution are discussed, and recent work and future directions in packaging are discussed The power-law relationship between input/output terminals is used in part to explain a number of these trends, including 3-D packaging, system-in-package, and potential nano-scale interconnection. In complex systems involving a mixture of component types, the goals of ultimate density and performance unfortunately compete with objectives of modularity and serviceability, so difficult systems design decisions must be confronted The trends in thermal management drive more aggressive schemes, though these solutions must combat the needs for compatibility with infrastructure and cost effectiveness.