Title :
Pixel multichip module design for a high energy physics experiment
Author :
Cardoso, G. ; Andresen, J. ; Appel, J.A. ; Chiodini, G. ; Christian, D.C. ; Hall, B.K. ; Kwan, S.W. ; Turqueti, M.A. ; Zimmermann, S.
Author_Institution :
Fermi Nat. Accel. Lab., USA
Abstract :
At Fermilab, a pixel detector multichip module is being developed for the BTeV experiment. The module is composed of three layers. The lowest layer is formed by the readout integrated circuits (ICs). The back of the ICs is in thermal contact with the supporting structure, while the top is flip-chip bump-bonded to the pixel sensor. A low mass flex-circuit interconnect is glued on the top of this assembly, and the readout IC pads are wire-bounded to the circuit. This paper presents recent results on the development of a multichip module prototype and summarizes its performance characteristics.
Keywords :
flip-chip devices; nuclear electronics; BTeV experiment; Fermilab; flip-chip bump-bonded; high energy physics experiment; low mass flex-circuit interconnect; multichip module prototype; pixel multichip module design; readout IC pads; readout integrated circuits; thermal contact; Assembly; Detectors; Integrated circuit interconnections; Laboratories; Magnetic fields; Multichip modules; Particle beams; Sensor arrays; Sensor phenomena and characterization; Thermal sensors;
Conference_Titel :
Nuclear Science Symposium Conference Record, 2003 IEEE
Print_ISBN :
0-7803-8257-9
DOI :
10.1109/NSSMIC.2003.1352000
