DocumentCode
1819703
Title
Are printed circuit board assemblies overtested?
Author
Mozar, Stefan ; Van Voorthuysen, Erik
Author_Institution
Sch. of Mech. & Manuf. Eng., Univ. of New South Wales, Sydney, NSW, Australia
fYear
2012
fDate
18-20 Nov. 2012
Firstpage
188
Lastpage
191
Abstract
This paper discusses the rational for testing printed circuit board assemblies (PCBA), and proposes a new strategy that differentiates between process control and functional performance. This strategy results in the potential elimination of process testing, and shifts the emphasis of testing to design evaluation and reliability testing. Better integration of the results derived from the product creation process coupled with an effective process control strategy will result in a more efficient process throughput, with better quality and more reliable PCBAs.
Keywords
assembling; circuit reliability; printed circuit design; printed circuit manufacture; printed circuit testing; process control; PCBA; design evaluation testing; printed circuit board assembly testing; printed circuit board manufacturing; process testing elimination; product creation process control strategy; reliability testing; Automatic Optical Inspection; Automatic X-ray Inspection; Design of Experiments; Functional testing; Incircuit Testing; Six Sigma; Statisical Process Control;
fLanguage
English
Publisher
ieee
Conference_Titel
Global High Tech Congress on Electronics (GHTCE), 2012 IEEE
Conference_Location
Shenzhen
Print_ISBN
978-1-4673-5086-0
Type
conf
DOI
10.1109/GHTCE.2012.6490154
Filename
6490154
Link To Document