Title :
Wide bandgap packaging for next generation power conversion systems
Author :
Passmore, Brandon ; Cole, Zach ; McPherson, Brice ; Whitaker, Barbee ; Martin, Daniel ; Barkley, Adam ; Reese, B. ; Shaw, Raymond ; McNutt, Ty ; Olejniczak, Kraig ; Lostetter, Alex
Author_Institution :
Arkansas Power Electron. Int., Inc., Fayetteville, AR, USA
Abstract :
APEI, Inc. manufactures high performance, high temperature wide bandgap discrete packages, multi-chip power modules (MCPMs), and integrated systems for extreme environment applications. In this paper, APEI, Inc. presents two MCPMs, the HT-2000 and X-5, and two discrete packages, the X-6, and XHV-2, which were designed using advanced packaging materials and processes enabling high temperature operation coupled with high performance operation due to the superior characteristics of wide bandgap power switches. The key features of each of these packages will be discussed in this report.
Keywords :
multichip modules; power semiconductor switches; wide band gap semiconductors; APEI, Inc; HT-2000 MCPM; X-5 MCPM; X-6 discrete package; XHV-2 discrete package; advanced packaging materials; high-performance high-temperature wide bandgap discrete packages; integrated systems; multichip power modules; next generation power conversion systems; wide bandgap power switches; HEMTs; Junctions; Logic gates; Packaging; Photonic band gap; Silicon carbide; Thermal resistance; Gallium Nitride; High Frequency; High Temperature; High Voltage; Power Electronics; Silicon Carbide; Wide Bandgap;
Conference_Titel :
Power Electronics for Distributed Generation Systems (PEDG), 2013 4th IEEE International Symposium on
Conference_Location :
Rogers, AR
DOI :
10.1109/PEDG.2013.6785623
