Title :
Multilevel thermal simulation of MCM´s by system `MONSTR-M´
Author :
Koval, Vladimir A. ; Fedasyuk, Dmytro V.
Author_Institution :
State Univ., Lviv, Ukraine
Abstract :
In this paper, a method of simulation and analysis of MCM´s thermal fields has been presented. The method is based on the MCM´s structure decomposition and formalization of the problem of heat exchange simulation among the elements of a structure. The general thermal model of the structure is presented as multi-level rectangular parallelepiped with the flat and bulky heat sources with the assumption about heat exchange with the environment by the system of initial and boundary conditions. Steady-state solution of thermal simulation problem in analytical form has been obtained. The “MONSTR-M” system of MCM´s thermal design is realized. Experimental results of thermal field simulation are presented
Keywords :
electronic engineering computing; heat transfer; multichip modules; simulation; thermal analysis; MCM thermal design; MONSTR-M system; heat exchange simulation; multilevel rectangular parallelepiped structure; multilevel thermal simulation; structure decomposition; thermal fields; thermal model; Analytical models; Heat sinks; Heat transfer; Multichip modules; Packaging; Pins; Resistance heating; Seals; Thermal conductivity; Thermal resistance;
Conference_Titel :
European Design and Test Conference, 1995. ED&TC 1995, Proceedings.
Conference_Location :
Paris
Print_ISBN :
0-8186-7039-8
DOI :
10.1109/EDTC.1995.470347
