DocumentCode
1820886
Title
Dielectric spectroscopy on natural rubber flatted sample with different temperature and time of vulcanization
Author
Kowalski, E.L. ; de Oliveira, S. Monteiro ; de Souza, G. Pinto ; Tomioka, J. ; Moares e Silva, J.M. ; Ruvolo-Filho, A. ; Robert, R.
Author_Institution
LACTEC, UFPR, Curitiba, Brazil
Volume
2
fYear
2003
fDate
1-5 June 2003
Firstpage
522
Abstract
Rubber (cis 1,4- polyisoprene) is an important raw material for several industrial applications and it is obtained from the Hevea brasiliensis latex (the Brazilian Rubber Tree). Due its suitable electrical, dielectric, mechanical, and thermal properties it is widely used to manufacture tools for handling electrical energy devices. Rubber for such applications is usually prepared with inorganic fillers and chemical additives (accelerators, plasticizer, antioxidants and sulfur). In this work dielectric spectroscopy measurements were performed in the frequency range from 10 μHz to 1MHz aiming to make the correlation between the degree of cross-linking of the rubber and its dielectric loss. Different cross-linking stages were obtained employing samples that were vulcanized during different period of time at different temperatures.
Keywords
dielectric losses; dielectric materials; permittivity; rubber; vulcanisation; 1,4- polyisoprene; 10 muHz to 1 GHz; accelerators; chemical additives; dielectric loss; dielectric materials; dielectric spectroscopy; electrical energy devices; electrical properties; inorganic fillers; mechanical properties; plasticizer; rubber flatted sample; thermal properties; vulcanization; Computational Intelligence Society; Dielectric devices; Dielectric loss measurement; Dielectric losses; Electrochemical impedance spectroscopy; Manufacturing industries; Mechanical factors; Raw materials; Rubber industry; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Properties and Applications of Dielectric Materials, 2003. Proceedings of the 7th International Conference on
ISSN
1081-7735
Print_ISBN
0-7803-7725-7
Type
conf
DOI
10.1109/ICPADM.2003.1218468
Filename
1218468
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