DocumentCode
1821591
Title
Eigen-signatures for regularity-based IDDQ testing
Author
Okuda, Yukio
Author_Institution
S&S Archit. Center, Sony Corp., Tokyo, Japan
fYear
2002
fDate
2002
Firstpage
289
Lastpage
294
Abstract
Researchers and test engineers challenge IDDQ testing on deep submicron (DSM) devices. We have proposed to test devices with high IDDQ currents at normal operating conditions based on exploiting the regularity of defect-free IDDQ signatures, the IDDQ responses of a circuit on a test vector set. This paper demonstrates the fundamental characteristics of the regularity and proposes a new methodology based on eigen-signatures. Eigen-signatures are unique signatures transformed from IDDQ signatures. The analysis of five eigen-signatures, including enhanced "Delta IDDQ" and "Current Ratios," on a product indicates that: the IDDQ values related to a test vector set have a small variation, whereas, the IDDQ magnitudes have a large variation; and the defect current prediction error of methods focusing the changes between the test vectors is 23 times smaller than the error of methods focusing the IDDQ magnitudes.
Keywords
CMOS digital integrated circuits; VLSI; electric current measurement; integrated circuit testing; CMOS devices; DECOUPLE; Delta IDDQ; IDDQ testing; current ratios; deep submicron devices; eigen-signatures; regularity; test vector set; Circuit testing; Electrical capacitance tomography; Electronic mail; Performance evaluation; Shape; System testing;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Test Symposium, 2002. (VTS 2002). Proceedings 20th IEEE
Print_ISBN
0-7695-1570-3
Type
conf
DOI
10.1109/VTS.2002.1011155
Filename
1011155
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