• DocumentCode
    1821619
  • Title

    Effect of an air layer on the insulation performance at the interface between epoxy resin and silicone rubber

  • Author

    Shibata, K. ; Ohki, Y. ; Takahashi, T. ; Okamoto, T.

  • Author_Institution
    Waseda Univ., Tokyo, Japan
  • Volume
    2
  • fYear
    2003
  • fDate
    1-5 June 2003
  • Firstpage
    622
  • Abstract
    We have proposed a concept of an environment-conscious all-solid-insulated substation system as a next generation substation. In order to make the system compact and its layout flexible, it is required to develop a compact connection system with solid insulating materials. A hard and a soft insulating material are to be used for this connection system. Therefore, there is a concern about air penetration into their interface at the time of connection, which reduces the insulation performance. In order to simulate this situation, a model connection part was made using an epoxy resin board as the hard material and a silicone rubber board as the soft material with a spacer inserted into their interface. The present paper reports experimental results on the breakdown strength under ac and impulse voltages. It is confirmed that the insulation performance decreases with an increase in the thickness of the air layer between the two boards.
  • Keywords
    dielectric materials; electric breakdown; epoxy insulation; silicone rubber; ac voltages; air layer thickness; air penetration; breakdown strength; compact connection system; compact system; environment-conscious solid-insulated substation system; epoxy resin-silicone rubber interface; hard insulating material; impulse voltages; insulation performance; layout; silicone rubber board; soft insulating material; solid insulating materials; Aging; Aluminum; Breakdown voltage; Electrodes; Epoxy resins; Insulation; Oils; Rubber; Substation protection; Sulfur hexafluoride;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Properties and Applications of Dielectric Materials, 2003. Proceedings of the 7th International Conference on
  • ISSN
    1081-7735
  • Print_ISBN
    0-7803-7725-7
  • Type

    conf

  • DOI
    10.1109/ICPADM.2003.1218494
  • Filename
    1218494