DocumentCode :
1821680
Title :
Effects of hydroxy silicone fluids on insulation properties of silicone rubber
Author :
Kang, D.P. ; Park, H.Y. ; Ahn, M.S. ; Lee, H.W. ; Lee, D.I.
Author_Institution :
Korea Electrotechnol. Res. Inst., Kyeongnam, South Korea
Volume :
2
fYear :
2003
fDate :
1-5 June 2003
Firstpage :
630
Abstract :
The hydroxy silicone(HS) fluids in silicone rubber(SIR) have been generally used as processing agent. The addition of HS fluids to SIR for insulator housing material is required to meet the good electrical performance and the good processability. In this study, SIR with HS fluids was evaluated to investigate how the kinds of them affect insulation properties. The contact angle of the virgin sample of 40-HS SIR was low and its recovery rate was also slow. The recovery rate of 50-HS SIR was the highest being decreased with the viscosity increase of HS fluids. The recovery rate of 1,040-HS SIR was a little slow at the initial stage. But the contact angle of that increased rapidly at the medium stage. The tracking resistances and the corona aging resistance of 70-HS SIR and 1,040-HS SIR were excellent. It is clear that resistances on discharges like corona, tracking, and arc depends largely on heat resistance of silicone fluids.
Keywords :
ageing; arcs (electric); association; contact angle; corona; dielectric materials; electric resistance; recovery; silicone rubber; viscosity; HS fluids; addition; arc; contact angle; corona aging resistance; electrical properties; heat resistance; hydroxy silicone fluids; insulation properties; processing agent; recovery rate; silicone rubber; tracking resistances; viscosity; Aging; Corona; Dielectrics and electrical insulation; Electric resistance; Insulation life; Polymers; Rubber; Surface contamination; Surface discharges; Surface resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Properties and Applications of Dielectric Materials, 2003. Proceedings of the 7th International Conference on
ISSN :
1081-7735
Print_ISBN :
0-7803-7725-7
Type :
conf
DOI :
10.1109/ICPADM.2003.1218496
Filename :
1218496
Link To Document :
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