DocumentCode
1821873
Title
Fault models for speed failures caused by bridges and opens
Author
Chakravarty, Sreejit ; Jain, Ankur
Author_Institution
Intel Archit. Group, Intel Corp., Santa Clara, CA, USA
fYear
2002
fDate
2002
Firstpage
373
Lastpage
378
Abstract
A number of new transition fault models for resistive vias and contacts in static CMOS circuits that cause speed failures are presented. The uniqueness of the new fault models are formally established. Fault simulation experiments performed on a large microprocessor show that there is no correlation between the newly proposed models and the classical fault models. Finally, we show that failures caused by bridges and opens in domino CMOS circuits require different fault models, and different test application considerations, than static CMOS circuits. It shows that there are defects that do not cause errors when tests are applied at high speed but fail when tests are applied at slow speed. This contradicts an assumption often made in speed-binning.
Keywords
CMOS digital integrated circuits; failure analysis; fault simulation; integrated circuit interconnections; integrated circuit testing; logic testing; bridges; contacts; domino CMOS circuits; dynamic CMOS circuits; fault simulation experiments; high speed tests; interconnect opens; large microprocessor; opens; resistive vias; sequential circuits; slow speed tests; speed failures; speed-binning; static CMOS circuits; test application considerations; transition fault models; Bridge circuits; Circuit faults; Circuit testing; Combinational circuits; Delay; Frequency; Integrated circuit interconnections; Microprocessors; Semiconductor device modeling; Sequential circuits;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Test Symposium, 2002. (VTS 2002). Proceedings 20th IEEE
Print_ISBN
0-7695-1570-3
Type
conf
DOI
10.1109/VTS.2002.1011167
Filename
1011167
Link To Document