DocumentCode
1822214
Title
Melt processible conducting polyaniline blend: mechanical and electrical properties
Author
Kim, Dong Hyun ; Lee, Tae Hee ; Kim, Jonig Eun ; Suh, Kwang S.
Author_Institution
Dept. of Mater. Sci., Korea Univ., Seoul, South Korea
Volume
2
fYear
2003
fDate
1-5 June 2003
Firstpage
726
Abstract
The effect of melt mixing process of conducting polymer, polyaniline with polystyrene was investigated. Polyaniline-dodecylbenzensulfonic acid (PANI-DBSA) complex was obtained by a one step emulsion polymerization for conducting blends. Polyaniline/Polystyrene conducting blends were prepared and mechanical properties such as tensile strength, elongation at break, modulus and electrical properties such as surface resistance, electrical conductivity, volume resistance and dielectric loss tangent were measured. It was found that the conductivity of polyaniline masterbatch is 6.99 S/cm and the percolation threshold of polyaniline blend was relatively low about 5 phr of polyaniline. The morphology of blends was setting closer to that of polyaniline and the dielectric loss increased up to 105 at 50% of polyaniline and was more dependent on temperature than frequency at higher polyaniline concentration.
Keywords
conducting polymers; dielectric losses; dielectric materials; ductile fracture; elastic moduli; electrical conductivity; elongation; percolation; polymer blends; polymer structure; polymerisation; surface resistance; tensile strength; dielectric loss tangent; electrical conductivity; electrical properties; elongation; mechanical properties; melt mixing; melt processible conducting polyaniline blend; modulus; one step emulsion polymerization; percolation threshold; polyaniline masterbatch; polyaniline-dodecylbenzensulfonic acid; polyaniline/polystyrene conducting blends; polymer morphology; surface resistance; temperature dependence; tensile strength; volume resistance; Conductivity measurement; Dielectric loss measurement; Dielectric losses; Dielectric measurements; Electric resistance; Electrical resistance measurement; Mechanical factors; Polymers; Surface morphology; Surface resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Properties and Applications of Dielectric Materials, 2003. Proceedings of the 7th International Conference on
ISSN
1081-7735
Print_ISBN
0-7803-7725-7
Type
conf
DOI
10.1109/ICPADM.2003.1218520
Filename
1218520
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