Title :
Twenty Second Annual IEEE Semiconductor Thermal Measurement and Management Symposium
Abstract :
The following topics are dealt with: semiconductor thermal measurement; thermal packaging; air cooling; thermal interface materials; thermal interface material testing; impingement, spray cooling, and refrigeration; thermoelectric implementation for high flux spreading; thermal materials development; power LED assembly packaging and testing; thermoreflectance; and thermo-mechanical challenges in stacked die packages
Keywords :
cooling; heat sinks; integrated circuit measurement; integrated circuit packaging; light emitting diodes; materials testing; semiconductor device measurement; semiconductor device packaging; thermal management (packaging); thermal resistance; thermoelectric devices; thermoreflectance; air cooling; power LED assemblies; refrigeration; semiconductor packaging; spray cooling; stacked die packages; thermal interface materials; thermal management; thermal materials; thermal packaging; thermoelectric implementation; thermoreflectance;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 2006 IEEE Twenty-Second Annual IEEE
Conference_Location :
Dallas, TX
Print_ISBN :
1-4244-0153-4
DOI :
10.1109/STHERM.2006.1625189
