Title :
Synthesis and characterization of corona-resistant nanocluster-trapped polyimide/silica composites
Author :
Zhang, M.Y. ; Yan, Chu ; Yong, Fan ; Lei, Q.Q.
Author_Institution :
Coll. of Electr. & Electron. Mater., Harbin Univ. of Sci. & Technol., China
Abstract :
A new class of corona-resistant films made of nanocluster-trapped polyimide/silica composites that were synthesized by the sol-gel reaction was obtained by the hydrolysis and poly-condensation of tetraethoxysilane (TEOS) or methyl-triethoxysilane (MTEOS) in the solution of polyamic acid(PAA) dissolved in N,N-dimethy-lacetamide (DMAc), followed by heating. The chemical structure and the surface morphology of the composites films were characterized by Atomic Force Microscope (AFM)- and Fourier Transform Infrared Spectroscope (FTIR). The corona-resistant capacity of the composites films was tested under high voltage using rod-plate electrode. The compatibility between the organic phase polyimide (PI) and inorganic phase silica (SiO2) had great effects on the properties of PI/SiO2 films, especially on their corona-resistant capacity. And this capacity of the Nanocluster-trapped PI/SiO2 films increased with increased content of silica.
Keywords :
Fourier transform spectra; atomic force microscopy; chemical structure; infrared spectra; nanocomposites; nanotechnology; polymer films; silicon compounds; sol-gel processing; surface morphology; AFM; FTIR; Fourier transform infrared spectra; PI/SiO2 films; SiO2; SiO2 compounds; atomic force microscopy; chemical structure; composites films; corona-resistant films properties; corona-resistant nanocluster preparation; hydrolysis; inorganic phase silica; organic phase polyimide; rod-plate electrode; sol-gel processing; surface morphology; trapped polyimide/silica composites; Atomic force microscopy; Chemicals; Fourier transforms; Heating; Infrared spectra; Polyimides; Silicon compounds; Spectroscopy; Surface morphology; Testing;
Conference_Titel :
Properties and Applications of Dielectric Materials, 2003. Proceedings of the 7th International Conference on
Print_ISBN :
0-7803-7725-7
DOI :
10.1109/ICPADM.2003.1218527