DocumentCode :
1822465
Title :
Effect of post-nitriding on electrical properties of high-permittivity hafnium and zirconium silicate films
Author :
Kato, H. ; Nango, T. ; Nakamura, K. ; Maeda, M. ; Ohki, Y. ; Ito, T.
Author_Institution :
Waseda Univ., Tokyo, Japan
Volume :
2
fYear :
2003
fDate :
1-5 June 2003
Firstpage :
765
Abstract :
The effect of post-annealing in nitrogen monoxide (NO) on the electrical properties of hafnium and zirconium silicate films prepared by plasma-enhanced chemical vapor deposition was investigated. The leakage current measured in the post-annealed film decreases by two orders of magnitude as compared to the s-deposited film. From FT-IR, ESR, and XPS analyses, it is found that the post-annealing makes the structural disorder smaller and reduces the interface states by nitridation. The C-V hysteresis width, which reflects the number of interface states, also decreases. These tendencies are observed both the hafnium and zirconium silicate films. It is concluded that the NO post-annealing can effectively improve the electrical properties of the two films.
Keywords :
Fourier transform spectra; dielectric hysteresis; dielectric materials; dielectric thin films; hafnium compounds; infrared spectra; interface states; leakage currents; nitridation; nitrogen compounds; paramagnetic resonance; permittivity; plasma CVD coatings; surface hardening; zirconium compounds; C-V hysteresis; ESR; FT-IR; HfSiO2; NO; XPS; ZrSiO2; electrical properties; interface states; leakage current; nitrogen monoxide compounds; permittivity hafnium silicate films; plasma-enhanced chemical vapor deposition; post-nitriding; zirconium silicate films; Chemical vapor deposition; Hafnium; Interface states; Leakage current; Nitrogen; Optical films; Plasma chemistry; Plasma measurements; Plasma properties; Zirconium;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Properties and Applications of Dielectric Materials, 2003. Proceedings of the 7th International Conference on
ISSN :
1081-7735
Print_ISBN :
0-7803-7725-7
Type :
conf
DOI :
10.1109/ICPADM.2003.1218530
Filename :
1218530
Link To Document :
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