DocumentCode :
1822491
Title :
Prediction of thermal performance degradation of air-cooled fine-pitch fin array heat sinks due to fouling
Author :
Nabi, Aharon ; Rodgers, Peter ; Bar-Cohen, Avram
Author_Institution :
Rafael Ltd., Haifa
fYear :
2006
fDate :
14-16 March 2006
Firstpage :
2
Lastpage :
9
Abstract :
The fouling of air-cooled fine-pitch heat sinks by air born dust particles has become a major reliability concern for desktop and notebook personal computers, where significant thermal performance degradation can result. This paper investigates for the first time heat sink fouling mechanisms by both analytical and experimental analyses. The contribution of two fouling modes, namely accumulation of a thermally insulative dust coating on the fins within the heat sink channels, and blockage of the heat sink leading edge entrance, is quantified. It is found that the former fouling mode does not significantly increase heat sink thermal resistance. Instead, heat sink thermal performance degradation is essentially attributable to leading edge entrance blockage, which reduces the airflow rate through the heat sink by increasing pressure drop
Keywords :
cooling; fine-pitch technology; heat sinks; microcomputers; notebook computers; reliability; thermal management (packaging); thermal resistance; air born dust particles; air cooling; desktop personal computers; fine-pitch fin array heat sinks; heat sink channels; heat sink fouling mechanisms; notebook personal computers; pressure drop; thermal performance degradation; thermal resistance; thermally insulative dust coating; Coatings; Heat engines; Heat sinks; Heat transfer; Resistance heating; Thermal conductivity; Thermal degradation; Thermal engineering; Thermal factors; Thermal resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 2006 IEEE Twenty-Second Annual IEEE
Conference_Location :
Dallas, TX
Print_ISBN :
1-4244-0153-4
Type :
conf
DOI :
10.1109/STHERM.2006.1625198
Filename :
1625198
Link To Document :
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