Title :
Dbc (direct bond copper) substrate with integrated flat heat pipe
Author :
Schulz-Harder, Jürgen ; Dezord, Jean Bernard ; Schaeffer, Christian ; Avenas, Yvan ; Puig, Olivier ; Rogg, Alexander ; Exel, Karl ; Utz-Kistner, Andreas
Author_Institution :
Curamik Electron. GmbH
Abstract :
A novel heat pipe design was developed consisting or a ceramic substrate sandwich with integrated flat heat pipe. On both sides of the heat pipe active electronic components, such as IGBT´s or MOSFET´s, can be mounted on an etched copper circuit. Heat densities over 80 W/cm2 can be dissipated easily. The functionality is independent of the working position either horizontal or vertical. The heat pipe can be used to an internal pressure over 7 bars without cracking the ceramic substrate. All requirements for space applications could be fulfilled. First application is foreseen for cooling DC-DC converters in satellites
Keywords :
ceramic insulation; cooling; copper; electronics packaging; heat pipes; Cu; DBC substrate; IGBT; MOSFET; active electronic component; ceramic substrate; cooling DC-DC converters; direct bond copper substrate; etched copper circuit; integrated flat heat pipe; space satellites; Bars; Bonding; Ceramics; Circuits; Cooling; Copper; DC-DC power converters; Electronic components; Etching; Insulated gate bipolar transistors;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 2006 IEEE Twenty-Second Annual IEEE
Conference_Location :
Dallas, TX
Print_ISBN :
1-4244-0153-4
DOI :
10.1109/STHERM.2006.1625221
