• DocumentCode
    182317
  • Title

    High performance infiltrant-free cryogenic machining of 82% density porous tungsten under computer numerical control

  • Author

    Schoop, Julius ; Jawahir, I.S. ; Balk, T. John ; Busbaher, Daniel

  • Author_Institution
    Inst. for Sustainable Manuf., Univ. of Kentucky, Lexington, KY, USA
  • fYear
    2014
  • fDate
    22-24 April 2014
  • Firstpage
    167
  • Lastpage
    168
  • Abstract
    Cryogenic machining was used as a means to eliminate the conventional methyl-methacrylate infiltration process used in the manufacture of dispenser cathode matrices. The resulting surfaces were analyzed before and after impregnation to determine their suitability for dispenser cathodes.
  • Keywords
    cathodes; cryogenics; machining; tungsten; W; computer numerical control; density porous tungsten; dispenser cathode matrices; infiltrant-free cryogenic machining; methyl-methacrylate infiltration process; Cathodes; Machining; Rough surfaces; Surface morphology; Surface roughness; Surface topography; Tungsten; cryogenic machining; dispenser cathode; porous tungsten; surface integrity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Vacuum Electronics Conference, IEEE International
  • Conference_Location
    Monterey, CA
  • Type

    conf

  • DOI
    10.1109/IVEC.2014.6857543
  • Filename
    6857543
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=182317