DocumentCode
1823195
Title
Vibrational spectroscopy of supermolecular assemblies
Author
Walls, Dennis J. ; Hughes, Kenneth ; Bohn, Paul W.
Author_Institution
Dept. of Chem., Illinois Univ., Urbana, IL, USA
fYear
1989
fDate
9-12 Nov 1989
Firstpage
1311
Abstract
Vibrational spectroscopy as a tool for ultrathin organic film structural investigations is considered. The application of total-internal-reflection-excited surface Raman spectroscopy to self-assembled and Langmuir-Blodgett monolayers and multilayer structures is described. The substrate is fused silica upon which a metallic mask has been deposited. Laser excitation is on-coupled from the rear through the ~100-μm opening in the mask. A metal island film (Ag or Au) of ~50-Å thickness is evaporated onto the substrate and is then covered with a sputtered dielectric layer. Typical results for a quaternary ammonium cationic amphiphile are shown. Two types of information can be obtained from the spectrum. The depolarization ratios can be used, at least in principle, to determine the orientation of the polarizability ellipsoid of the molecule, and spectral interpretation can be used just as in bulk systems
Keywords
Langmuir-Blodgett films; Raman spectra of organic molecules and substances; Ag; Au; Langmuir-Blodgett monolayers; depolarization ratios; fused SiO2 substrate; laser excitation; metal island film; metallic mask; multilayer structures; polarizability ellipsoid; quaternary ammonium cationic amphiphile; self-assembled monolayers; spectral interpretation; sputtered dielectric layer; supermolecular assemblies; total-internal-reflection-excited surface Raman spectroscopy; ultrathin organic film structural investigations; vibrational spectroscopy; Assembly; Dielectric substrates; Ellipsoids; Gold; Laser excitation; Nonhomogeneous media; Polarization; Raman scattering; Silicon compounds; Spectroscopy;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society, 1989. Images of the Twenty-First Century., Proceedings of the Annual International Conference of the IEEE Engineering in
Conference_Location
Seattle, WA
Type
conf
DOI
10.1109/IEMBS.1989.96211
Filename
96211
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