DocumentCode :
1823642
Title :
Small footprint ESD protection of hot-swappable I/Os
Author :
Karp, James ; Fakhruddin, Mohammed ; Hart, Michael ; Li, Richard ; Ho, Fu-Hing ; Reilly, Steven ; Tan, Phoumra ; Tsaggaris, Dean ; Pai, S.Y.
Author_Institution :
Xilinx Inc., San Jose, CA, USA
fYear :
2011
fDate :
11-16 Sept. 2011
Firstpage :
1
Lastpage :
6
Abstract :
A small footprint ESD protection scheme is developed for the hot-swappable chip interface (I/O). Elimination of ESD elements in the I/O to VCCO path, and elimination of ESD elements for LVDS drivers has enabled ~50% ESD area reduction. The design is qualified for production and has passed ESD specifications of 2000V HBM, 500V CDM, and 200V MM with excellent margin.
Keywords :
electrostatic discharge; CDM; HBM; LVDS drivers; MM; VCCO path; footprint ESD protection; hot swappable chip interface; voltage 200 V; voltage 2000 V; voltage 500 V; Discharges; Electrostatic discharge; MOS devices; Resistors; Stress; Substrates;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD), 2011 33rd
Conference_Location :
Anaheim, CA
ISSN :
Pending
Electronic_ISBN :
Pending
Type :
conf
Filename :
6045577
Link To Document :
بازگشت