• DocumentCode
    1823809
  • Title

    Analysis of thermal breakdown process with EVA film in room temperature region

  • Author

    Murakami, Y. ; Hozumi, N. ; Nagao, M. ; Mitsumoto, S. ; Fukuma, M.

  • Author_Institution
    Nagano Nat. Coll. of Technol., Japan
  • Volume
    3
  • fYear
    2003
  • fDate
    1-5 June 2003
  • Firstpage
    962
  • Abstract
    In order to understand dc breakdown characteristics of ethylene-vinyl acetate copolymer (EVA) film at the room temperature, temperature distribution of film surface until the electric breakdown was observed by thermograph. Conduction current of EVA film was also measured and correlated with the thermograph. From the conduction current, hopping distance was estimated as 2.1×10-9 [m]. The potential barrier was calculated as 1.I [eV]. The heat generation was estimated by the equation of hopping conduction using hopping distance and potential barrier. The heat dissipation was also determined by thermal properties of the EVA film. A good agreement was found between the estimated heat balance and the observed temperature rise, suggesting that thermal breakdown takes place in room temperature region.
  • Keywords
    cooling; dielectric thin films; electric breakdown; hopping conduction; insulating thin films; organic insulating materials; polymer blends; polymer films; temperature distribution; 293 to 298 K; EVA film; conduction current; dc breakdown characteristics; electric breakdown; ethylene-vinyl acetate copolymer film; film surface; hopping conduction; potential barrier; room temperature; temperature distribution; thermal breakdown; thermal properties; Atmospheric measurements; Breakdown voltage; Conductive films; Current measurement; Density measurement; Electric breakdown; Electric variables measurement; Electrodes; Gold; Temperature distribution;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Properties and Applications of Dielectric Materials, 2003. Proceedings of the 7th International Conference on
  • ISSN
    1081-7735
  • Print_ISBN
    0-7803-7725-7
  • Type

    conf

  • DOI
    10.1109/ICPADM.2003.1218581
  • Filename
    1218581