DocumentCode
1823863
Title
Defects in Langmuir-Blodgett films and their influence on electric properties
Author
Wei, Yu ; Lin, Ci ; Lu, Zuhong
Author_Institution
Southeast Univ., Nanjing, China
fYear
1989
fDate
9-12 Nov 1989
Abstract
Summary form only given. The use of the Langmuir-Blodgett (LB) technique to construct various multilayered structures of potential use in molecular electronics is discussed. The defects in the films and their distribution have been studied mainly by investigating dislocations in the films and traps situated on both the impurities and the interfaces between the films and the substrates. To investigate the structure of the multilayer films with or without the mosaic spread, X-ray diffraction was used. The electronic properties of LB insulating films in their pre-dielectric-breakdown range, i.e. the time-dependent dielectric breakdown (TDDB) characteristic, was studied. Preliminary results showed that TDDB is very likely to be defect related. The defect density distribution at the film-substrate interface was obtained from the model proposed, which provides an excellent means of probing defect concentrations
Keywords
Langmuir-Blodgett films; X-ray diffraction examination of materials; dislocations; electric breakdown of solids; molecular electronics; Langmuir-Blodgett films; X-ray diffraction; defect concentrations; defect density distribution; dislocations; electric properties; electronic properties; film-substrate interface; impurities; molecular electronics; mosaic spread; multilayered structures; pre-dielectric-breakdown range; substrates; time dependent dielectric breakdown characteristic; traps; Dielectric thin films; Impurities; Molecular electronics; Nonhomogeneous media; Optical devices; Optical films; Optical refraction; Optical variables control; Thermodynamics; X-ray diffraction;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society, 1989. Images of the Twenty-First Century., Proceedings of the Annual International Conference of the IEEE Engineering in
Conference_Location
Seattle, WA
Type
conf
DOI
10.1109/IEMBS.1989.96214
Filename
96214
Link To Document