Title :
Copper electroforming for UV LIGA technology
Author :
Hanyan Li ; Xinghui Li ; Guodong Bai ; Jinjun Feng
Author_Institution :
Nat. Key Lab. of Sci. & Technol. on Vacuum Electron., Beijing Vacuum Electron. Res. Inst., Beijing, China
Abstract :
This paper investigates effects of current waveforms and densities on surface morphology and microstructural characterization of copper films. Comparing to the direct current (DC) waveform, the pulse waveform plating produces a fine, void-free grain copper structure. The grain size of copper films is 194 nm and copper films are capable of enduring high temperature without bubbles.
Keywords :
LIGA; copper; electroplating; metallic thin films; millimetre wave tubes; submillimetre wave tubes; surface morphology; vacuum tubes; Cu; UV LIGA technology; copper electroforming; copper film microstructure; direct current waveform; pulse waveform plating; size 194 nm; surface morphology density; void free grain copper structure; Copper; Current density; Films; Morphology; Substrates; Surface morphology; Vacuum technology; Copper electroplating; Current density; DC plating; Pulse plating;
Conference_Titel :
Vacuum Electronics Conference, IEEE International
Conference_Location :
Monterey, CA
DOI :
10.1109/IVEC.2014.6857581
