DocumentCode
182388
Title
Copper electroforming for UV LIGA technology
Author
Hanyan Li ; Xinghui Li ; Guodong Bai ; Jinjun Feng
Author_Institution
Nat. Key Lab. of Sci. & Technol. on Vacuum Electron., Beijing Vacuum Electron. Res. Inst., Beijing, China
fYear
2014
fDate
22-24 April 2014
Firstpage
245
Lastpage
246
Abstract
This paper investigates effects of current waveforms and densities on surface morphology and microstructural characterization of copper films. Comparing to the direct current (DC) waveform, the pulse waveform plating produces a fine, void-free grain copper structure. The grain size of copper films is 194 nm and copper films are capable of enduring high temperature without bubbles.
Keywords
LIGA; copper; electroplating; metallic thin films; millimetre wave tubes; submillimetre wave tubes; surface morphology; vacuum tubes; Cu; UV LIGA technology; copper electroforming; copper film microstructure; direct current waveform; pulse waveform plating; size 194 nm; surface morphology density; void free grain copper structure; Copper; Current density; Films; Morphology; Substrates; Surface morphology; Vacuum technology; Copper electroplating; Current density; DC plating; Pulse plating;
fLanguage
English
Publisher
ieee
Conference_Titel
Vacuum Electronics Conference, IEEE International
Conference_Location
Monterey, CA
Type
conf
DOI
10.1109/IVEC.2014.6857581
Filename
6857581
Link To Document