Title :
CDM event simulation in SPICE: A holistic approach
Author :
Hajjar, Jean-Jacques ; Weyl, Thorsten ; Zhou, Yuanzhong ; Parthasarathy, Srivatsan
Author_Institution :
Analog Devices, Wilmington, MA, USA
Abstract :
A flow and a CAD tool for the simulation of the ESD CDM classification test event in SPICE is described. The methodology consists of deconstructing the CDM test into its relevant components. The modeling and calibration of each component is shown to be essential in the development of a generic simulation approach predicting CDM pass and fail levels. The successful implementation of the flow is demonstrated with a real circuit design example.
Keywords :
CAD; SPICE; charge-coupled devices; electrostatic discharge; CAD tool; CDM event simulation; ESD CDM classification test event; SPICE; fail levels; generic simulation approach; real circuit design; Capacitance; Electrostatic discharge; Integrated circuit modeling; Resistance; SPICE; Solid modeling; Stress;
Conference_Titel :
Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD), 2011 33rd
Conference_Location :
Anaheim, CA
Electronic_ISBN :
Pending
