Title :
Thermal co-simulation of coaxial RF window and connector of a TWT
Author :
Hemamalini, R. ; Rao, P. Raja Ramana ; Rao, K.V. ; Datta, Soumya Kanti ; Bhattacharya, C. ; Kamath, Sanmati
Author_Institution :
Microwave Tube R&D Centre, Bangalore, India
Abstract :
Thermal co-simulation of coaxial output couplers (including the coaxial RF window and the RF connector) of a medium power CW helix TWT has been carried out using CST Microwave Studio and thermal solver of the CST Studio Suite. The RF losses as obtained from the frequency domain analysis are used in the co-simulation and the temperature profile of the window and the connector has been analyzed using suitable thermal boundaries and actual material properties. The co-simulation could be used for optimizing the design of a coupler with a considered decision on the thermal management.
Keywords :
thermal management (packaging); travelling wave tubes; CST Microwave Studio; CST Studio Suite; RF connector; RF losses; TWT; coaxial RF window; coaxial output couplers; frequency domain analysis; thermal boundaries; thermal cosimulation; thermal management; thermal solver; travelling wave tubes; Analytical models; Computational modeling; Connectors; Couplers; Electromagnetic heating; Radio frequency; Thermal management; Coaxial Connector; Coaxial Coupler; Coaxial window; TWT; Thermal co-simulation;
Conference_Titel :
Vacuum Electronics Conference, IEEE International
Conference_Location :
Monterey, CA
DOI :
10.1109/IVEC.2014.6857588